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One free scan finds every outdated or missing driver and matches the right update for your exact hardware.Free scan · exact hardware matchTSMC said in its third-quarter 2026 report that construction of its second Arizona fabrication plant is complete. The building now moves into equipment installation and production preparation; Arizona officials and NIST expect 3nm volume manufacturing in 2027, with NIST specifying the second half of the year.
What TSMC confirmed
Chip Dispatch reported on October 15, 2026, that TSMC confirmed the construction milestone during its third-quarter report. The second fab is transitioning from building work to installing semiconductor-production tools and preparing for eventual chip manufacturing.
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“Construction complete” does not mean the plant is already producing saleable wafers. A finished structure still needs manufacturing equipment, process setup and the operational work required before high-volume output can begin.
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Clear out junk files and repair common Windows errorsFree Scan →Fix the driver behind crashes, sound loss and screen glitchesFind Drivers →TSMC’s Arizona project page says the second fab’s structure was completed in 2025. The newer 2026 report refers to completion of the broader construction phase, so the two dates describe different points in the project rather than a contradiction.
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When will the second fab make 3nm chips?
The Arizona Commerce Authority said on July 16, 2026, that the second fab will use 3nm process technology and that volume production is expected in 2027. NIST’s project profile narrows that target to the second half of 2027.
That schedule is newer than TSMC’s 2024 announcement, which described the second fab as adding 2nm capability and beginning production in 2028. The 2028 date should therefore be treated as an earlier plan superseded by the current 2027 target. Because TSMC’s phased Arizona plans have changed, the final process mix should be described cautiously rather than assuming that every earlier 2nm detail remains unchanged.
Arizona project timeline
| Milestone | Date or target | What it means |
|---|---|---|
| First fab high-volume production | Q4 2024 | TSMC says N4 production began at the first Arizona fab. |
| Second fab structure | 2025 | TSMC’s Arizona project page records structural completion. |
| Second fab construction phase | Confirmed October 2026 | TSMC reported that construction is complete and the site is moving toward tool installation. |
| Second fab 3nm volume production | 2027 target; NIST says second half | Expected manufacturing date stated by Arizona Commerce and NIST, not a report of current output. |
Why this milestone matters to U.S. chip manufacturing
NIST says the three Arizona fabs are expected, at full capacity, to manufacture tens of millions of leading-edge logic chips. The intended applications include 5G and 6G smartphones, autonomous vehicles, high-performance computing and artificial-intelligence systems.
The completed building is therefore a construction milestone in a wider U.S. leading-edge supply-chain program. It advances domestic capacity for advanced logic production, but the economic and supply benefits depend on successful equipment installation, process readiness and the later ramp to high-volume manufacturing.
NIST also says TSMC Arizona is expected to give customers an opportunity to buy advanced chips made entirely on U.S. soil. That describes the project’s expected capability; it is not evidence that the second fab is currently shipping chips.
Investment, jobs and projected output
| Measure | Figure | Qualification |
|---|---|---|
| Three-fab Arizona capital expenditure | More than $65 billion | TSMC announcement from 2024 for the planned three-fab Arizona program. |
| Direct employment | Approximately 6,000 jobs | TSMC and the U.S. Commerce Department estimate from 2024; described as high-tech, high-wage positions. |
| Arizona expansion investment | Additional $100 billion | Amount announced by the Arizona Commerce Authority in 2026 for expansion investment in Arizona; it should not be read as the cost of the second building alone. |
| Combined output of first two fabs | More than 600,000 wafers per year | TSMC projection from 2022, referring to the first two Arizona fabs together. |
| Associated end-product value | More than US$40 billion | TSMC projection from 2022 for the combined first-two-fab operation. |
What happens after construction
- Install production tools: The completed facility moves toward bringing in and setting up the equipment used to fabricate wafers.
- Prepare the process: The fab must establish the manufacturing conditions for its planned node before it can ramp output.
- Advance toward volume production: The public schedule points to 3nm high-volume manufacturing in 2027, with NIST’s target in the second half of that year.
These steps are why a completed shell should not be confused with an operating fab. The October 2026 announcement marks the end of major construction, not the start of commercial wafer shipments.
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What to watch next
- Reports that tool installation has progressed beyond the building-completion milestone.
- Any revision to the 2027 high-volume-production schedule.
- Clarification from TSMC on the final mix of 3nm and any other process technologies in the phased Arizona plan.
- Evidence that the second fab has moved from preparation into actual high-volume output.
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